5962-9315701HXA 256K X 8 MULTI DEVICE SRAM MODULE, 120 ns, DIP32
From Defense Logistics Agency
| Status | ACTIVE |
| Access Time-Max (tACC) | 120 ns |
| Memory Density | 2.10E6 deg |
| Memory IC Type | MULTI DEVICE SRAM MODULE |
| Memory Width | 8 |
| Mfr Package Description | DIP-32 |
| Number of Functions | 1 |
| Number of Terminals | 32 |
| Number of Words | 262144 words |
| Number of Words Code | 256K |
| Operating Mode | ASYNCHRONOUS |
| Operating Temperature-Max | 125 Cel |
| Operating Temperature-Min | -55 Cel |
| Organization | 256K X 8 |
| Package Body Material | UNSPECIFIED |
| Package Shape | RECTANGULAR |
| Package Style | IN-LINE |
| Parallel/Serial | PARALLEL |
| Supply Voltage-Max (Vsup) | 5.5 V |
| Supply Voltage-Min (Vsup) | 4.5 V |
| Supply Voltage-Nom (Vsup) | 5 V |
| Technology | CMOS |
| Temperature Grade | MILITARY |
| Terminal Finish | TIN LEAD |
| Terminal Form | THROUGH-HOLE |
| Terminal Pitch | 2.54 mm |
| Terminal Position | DUAL |
