CDR03BX333BMSP\M Cap Ceramic 0.033uF 100V BX 20% Pad SMD 1808 (0.1%FR) 125C Bulk
From AVX
| Capacitance | 33000(pF) |
| Case Style | Ceramic Chip |
| Construction | SMT Chip |
| Failure Rate | P |
| Lead Diameter (nom) | Not Required(mm) |
| Microwave Application | NO |
| Mounting Style | Surface Mount |
| Number of Terminals | 2 |
| Operating Temp Range | -55C to 125C |
| Package / Case | 1808 |
| Packaging | Bulk |
| Product Depth (mm) | 2.03(mm) |
| Product Diameter (mm) | Not Required(mm) |
| Product Height (mm) | 2.03(mm) |
| Product Length (mm) | 4.57(mm) |
| Rad Hardened | No |
| Seated Plane Height | Not Required(mm) |
| Technology | STANDARD |
| Temp Coeff (Dielectric) | BX |
| Termination Style | PAD |
| Tolerance (+ or -) | 20% |
| Voltage | 100VDC |
| Wire Form | Not Required |
