EPC2012 TRANS GAN 200V 3A BUMPED DIE
From EPC
Category | Discrete Semiconductor Products |
Current - Continuous Drain (Id) @ 25°C | 3A (Ta) |
Datasheets | EPC2012 |
Drain to Source Voltage (Vdss) | 200V |
FET Feature | Logic Level Gate |
FET Type | GaNFET N-Channel, Gallium Nitride |
Family | FETs - Single |
Featured Product | eGaN™ FETs |
Gate Charge (Qg) @ Vgs | 1.5nC @ 100V |
Input Capacitance (Ciss) @ Vds | 128pF @ 100V |
Mfg Application Notes | Second Generation eGaN® FETs Assembling eGaN® FETs Using eGaN® FETs |
Mounting Type | Surface Mount |
Online Catalog | N-Channel Logic Level Gate FETs |
Other Names | 917-1017-6 |
PCN Assembly/Origin | EPC2yyy Family Process Change 14/Dec/2013 |
PCN Design/Specification | EPC20xx Material 10/Apr/2013 |
PCN Other | Multiple Changes 24/Jun/2014 |
Package / Case | Die |
Packaging | Digi-Reel® |
Power - Max | - |
Product Photos | EPC1012 |
Product Training Modules | Paralleling eGaN® FETs |
Rds On (Max) @ Id, Vgs | 100 mOhm @ 3A, 5V |
Series | eGaN® |
Standard Package | 1 |
Supplier Device Package | Die |
Vgs(th) (Max) @ Id | 2.5V @ 1mA |
Video File | EPC eGaN FETs -- Another Geek Moment | DigiKey |