GS8662DT07BGD-300IT 8M X 8 QDR SRAM, 0.45 ns, PBGA165
From GSI Technology
Status | ACTIVE |
Access Time-Max (tACC) | 0.4500 ns |
Memory Density | 6.71E7 deg |
Memory IC Type | QDR SRAM |
Memory Width | 8 |
Mfr Package Description | 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 |
Number of Functions | 1 |
Number of Terminals | 165 |
Number of Words | 8.39E6 words |
Number of Words Code | 8M |
Operating Mode | SYNCHRONOUS |
Operating Temperature-Max | 85 Cel |
Operating Temperature-Min | -40 Cel |
Organization | 8M X 8 |
Package Body Material | PLASTIC/EPOXY |
Package Shape | RECTANGULAR |
Package Style | GRID ARRAY, LOW PROFILE |
Parallel/Serial | PARALLEL |
Supply Voltage-Max (Vsup) | 1.9 V |
Supply Voltage-Min (Vsup) | 1.7 V |
Supply Voltage-Nom (Vsup) | 1.8 V |
Surface Mount | Yes |
Temperature Grade | INDUSTRIAL |
Terminal Form | BALL |
Terminal Pitch | 1 mm |
Terminal Position | BOTTOM |