HX6409DBFC 4K X 9 OTHER FIFO, 30 ns, CQFP68
From Honeywell - Microelectronics & Precision Sensors
| Status | ACTIVE |
| Access Time-Max (tACC) | 30 ns |
| Cycle Time | 34 ns |
| Memory Density | 36864 deg |
| Memory IC Type | OTHER FIFO |
| Memory Width | 9 |
| Mfr Package Description | CERAMIC, QFP-68 |
| Number of Functions | 1 |
| Number of Terminals | 68 |
| Number of Words | 4096 words |
| Number of Words Code | 4K |
| Operating Mode | SYNCHRONOUS |
| Operating Temperature-Max | 125 Cel |
| Operating Temperature-Min | -55 Cel |
| Organization | 4K X 9 |
| Output Enable | Yes |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED |
| Package Shape | SQUARE |
| Package Style | FLATPACK |
| Supply Voltage-Max (Vsup) | 5.5 V |
| Supply Voltage-Min (Vsup) | 4.5 V |
| Supply Voltage-Nom (Vsup) | 5 V |
| Surface Mount | Yes |
| Temperature Grade | MILITARY |
| Terminal Form | FLAT |
| Terminal Pitch | 1.27 mm |
| Terminal Position | QUAD |
