EDI784MSV50BI 4M X 8 FLASH 3V PROM, 35 ns, CDSO24
From Microsemi Corp.
| Status | ACTIVE |
| Access Time-Max (tACC) | 35 ns |
| Memory Density | 3.36E7 deg |
| Memory IC Type | FLASH 3V PROM |
| Memory Width | 8 |
| Mfr Package Description | CERAMIC, THINPACK-32/24 |
| Number of Functions | 1 |
| Number of Terminals | 24 |
| Number of Words | 4.19E6 words |
| Number of Words Code | 4M |
| Operating Mode | SYNCHRONOUS |
| Operating Temperature-Max | 85 Cel |
| Operating Temperature-Min | -40 Cel |
| Organization | 4M X 8 |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE |
| Parallel/Serial | PARALLEL |
| Supply Voltage-Max (Vsup) | 3.6 V |
| Supply Voltage-Min (Vsup) | 3 V |
| Supply Voltage-Nom (Vsup) | 3.3 V |
| Surface Mount | Yes |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | NOT SPECIFIED |
| Terminal Form | GULL WING |
| Terminal Pitch | 1.27 mm |
| Terminal Position | DUAL |
