WF1M32B-100HI3A 1M X 32 FLASH 3.3V PROM MODULE, 100 ns, CPGA66
From Microsemi Corp.
Status | ACTIVE |
Access Time-Max (tACC) | 100 ns |
Memory Density | 3.36E7 deg |
Memory IC Type | FLASH 3.3V PROM MODULE |
Memory Width | 32 |
Mfr Package Description | 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 |
Number of Functions | 1 |
Number of Terminals | 66 |
Number of Words | 1.05E6 words |
Number of Words Code | 1M |
Operating Mode | ASYNCHRONOUS |
Operating Temperature-Max | 85 Cel |
Operating Temperature-Min | -40 Cel |
Organization | 1M X 32 |
Package Body Material | CERAMIC, METAL-SEALED COFIRED |
Package Shape | SQUARE |
Package Style | GRID ARRAY |
Parallel/Serial | PARALLEL |
Supply Voltage-Max (Vsup) | 3.6 V |
Supply Voltage-Min (Vsup) | 3 V |
Supply Voltage-Nom (Vsup) | 3.3 V |
Technology | CMOS |
Temperature Grade | INDUSTRIAL |
Terminal Finish | TIN LEAD |
Terminal Form | PIN/PEG |
Terminal Pitch | 2.54 mm |
Terminal Position | PERPENDICULAR |