WF1M32B-100HI3A
1M X 32 FLASH 3.3V PROM MODULE, 100 ns, CPGA66

From Microsemi Corp.

StatusACTIVE
Access Time-Max (tACC)100 ns
Memory Density3.36E7 deg
Memory IC TypeFLASH 3.3V PROM MODULE
Memory Width32
Mfr Package Description1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Number of Functions1
Number of Terminals66
Number of Words1.05E6 words
Number of Words Code1M
Operating ModeASYNCHRONOUS
Operating Temperature-Max85 Cel
Operating Temperature-Min-40 Cel
Organization1M X 32
Package Body MaterialCERAMIC, METAL-SEALED COFIRED
Package ShapeSQUARE
Package StyleGRID ARRAY
Parallel/SerialPARALLEL
Supply Voltage-Max (Vsup)3.6 V
Supply Voltage-Min (Vsup)3 V
Supply Voltage-Nom (Vsup)3.3 V
TechnologyCMOS
Temperature GradeINDUSTRIAL
Terminal FinishTIN LEAD
Terminal FormPIN/PEG
Terminal Pitch2.54 mm
Terminal PositionPERPENDICULAR

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