CL21F224ZBCNNNC Cap Ceramic 0.22uF 50V Y5V -20% to 80% Pad SMD 0805 85C T/R
From SAMSUNG
| Capacitance | 220000(pF) |
| Case Style | Ceramic Chip |
| Construction | SMT Chip |
| Failure Rate | Not Required |
| Lead Diameter (nom) | Not Required(mm) |
| Microwave Application | NO |
| Mounting Style | Surface Mount |
| Number of Terminals | 2 |
| Operating Temp Range | -30C to 85C |
| Package / Case | 0805 |
| Packaging | Tape and Reel |
| Product Depth (mm) | 1.25(mm) |
| Product Diameter (mm) | Not Required(mm) |
| Product Height (mm) | 0.85(mm) |
| Product Length (mm) | 2(mm) |
| Rad Hardened | No |
| Seated Plane Height | Not Required(mm) |
| Technology | STANDARD |
| Temp Coeff (Dielectric) | Y5V |
| Termination Style | PAD |
| Tolerance (+ or -) | -20% to 80% |
| Voltage | 50VDC |
| Wire Form | Not Required |
