CL21F105ZBFNNNG Cap Ceramic 1uF 50V Y5V -20% to 80% Pad SMD 0805 85C T/R
From SAMSUNG
Capacitance | 1000000(pF) |
Case Style | Ceramic Chip |
Construction | SMT Chip |
Failure Rate | Not Required |
Lead Diameter (nom) | Not Required(mm) |
Microwave Application | NO |
Mounting Style | Surface Mount |
Number of Terminals | 2 |
Operating Temp Range | -30C to 85C |
Package / Case | 0805 |
Packaging | Tape and Reel |
Product Depth (mm) | 1.25(mm) |
Product Diameter (mm) | Not Required(mm) |
Product Height (mm) | 1.25(mm) |
Product Length (mm) | 2(mm) |
Rad Hardened | No |
Seated Plane Height | Not Required(mm) |
Technology | STANDARD |
Temp Coeff (Dielectric) | Y5V |
Termination Style | PAD |
Tolerance (+ or -) | -20% to 80% |
Voltage | 50VDC |
Wire Form | Not Required |