C2012C0G1V303J060AC Cap Ceramic 0.03uF 35V C0G 5% Pad SMD 0805 125C T/R
From TDK
| Capacitance | 30000(pF) |
| Case Style | Ceramic Chip |
| Construction | SMT Chip |
| Failure Rate | Not Required |
| Lead Diameter (nom) | Not Required(mm) |
| Microwave Application | YES |
| Mounting Style | Surface Mount |
| Number of Terminals | 2 |
| Operating Temp Range | -55C to 125C |
| Package / Case | 0805 |
| Packaging | Tape and Reel |
| Product Depth (mm) | 1.25(mm) |
| Product Diameter (mm) | Not Required(mm) |
| Product Height (mm) | 0.6(mm) |
| Product Length (mm) | 2(mm) |
| Rad Hardened | No |
| Seated Plane Height | Not Required(mm) |
| Technology | STANDARD |
| Temp Coeff (Dielectric) | C0G |
| Termination Style | PAD |
| Tolerance (+ or -) | 5% |
| Voltage | 35VDC |
| Wire Form | Not Required |
