W25Q128BVCIP 128M X 1 SPI BUS SERIAL EEPROM, PBGA24
From Winbond Electronics Corporation America
| Status | DISCONTINUED |
| Clock Frequency-Max (fclk) | 104 MHz |
| Memory Density | 1.28E8 deg |
| Memory IC Type | FLASH 2.7V PROM |
| Memory Width | 1 |
| Mfr Package Description | 8 X 6 MM, GREEN, TFBGA-24 |
| Number of Functions | 1 |
| Number of Terminals | 24 |
| Number of Words | 1.28E8 words |
| Number of Words Code | 128M |
| Operating Mode | SYNCHRONOUS |
| Operating Temperature-Max | 85 Cel |
| Operating Temperature-Min | -40 Cel |
| Organization | 128M X 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, THIN PROFILE |
| Parallel/Serial | SERIAL |
| Supply Voltage-Max (Vsup) | 3.6 V |
| Supply Voltage-Min (Vsup) | 2.7 V |
| Supply Voltage-Nom (Vsup) | 3 V |
| Surface Mount | Yes |
| Temperature Grade | INDUSTRIAL |
| Terminal Form | BALL |
| Terminal Pitch | 1 mm |
| Terminal Position | BOTTOM |
